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Keywords: Sn3.0Ag0.5Cu (SAC305)
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Journal Articles
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2025) 42 (2): 18–27.
Published: 13 February 2025
... of deep space exploration. In this study, the Sn3.0Ag0.5Cu (SAC305)/Cu solder joints were prepared and thermally shocked with temperatures ranging from −110°C to 110°C, to investigate the effects of extreme temperature thermal shock on the microstructural evolution and property deterioration of the solder...
