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Keywords: Stud bump bonding
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Journal Articles
Assembly issues in three flip chip processes
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2000) 17 (2): 15–18.
Published: 01 August 2000
... distance during reflow. Finally, the stud bump bonding process is also discussed. It is not easy although possible to maintain the optimal dipping of the conductive adhesive, when the average height of the gold bumps is small. Some solutions for overcoming the above‐mentioned difficulties are presented...
