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Keywords: System-in-package
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Journal Articles
Data acquisition and processing circuit for high-temperature logging up to 200°C
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2020) 37 (3): 131–138.
Published: 27 March 2020
...Jingxuan Peng; Jingjing Cheng; Lei Wu; Qiong Li Purpose This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging. Design/methodology/approach With the decrease in thermal resistance by system-in package technology and exquisite power...
