... integration. The substance of a 2.5 D integration is called silicon interposer, which consists of the through silicon via (TSV) and redistribution layer. However, the state-of-the-art silicon interposer is not able to sustain its own mechanical strength with the detector/readout array often sitting...

... covers the complete RF front-end chain from the antenna to signal to process and can be applied in 5 G communication and automotive components. Originality/value With three RF multi-function chips and two through silicon via (TSV) chips were embedded in the 12 inch compound wafer through the fan-out...

... signal transmission characteristics. According to the simulation results, decreasing the height of the through silicon via (TSV), increasing the radius of the TSV, reducing the length of Si and increasing the number of grounded through silicon via have positive effects on improving the radiation...