... NanoVia, LP has announced the development of an optical beam delivery system specifically tailored to improving the throughput of laser-based semiconductor wafer dicing processes. Using a patent pending dual and triple wavelength technology, the MultiDice™ platform provides pre-removal of first...

...Brian Ellis The general theme puts more emphasis on climate change than on ozone depletion, but both of these are important to – and have repercussions on– our industry. The Forum started with a general plenary session, which was chaired by Judith Baker of United Technologies. She introduced...

...P.J. Palmer; D.J. Williams This paper begins with a brief review of previous work in the field of technology forecasting and discusses the Fisher Pry model in particular, before concluding with an attempt at forecasting the rate of development of smart technology. The Fisher Pry model is shown...

... © MCB UP Limited 1999 --> Dicing Manufacturing Technology Wafer dicing and singulation system ideal for advanced materials Keywords Dicing, Manufacturing, Technology Manufacturing Technology,Inc. (MTI) manufacturer of high precision, high performance slicing...