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Keywords: Thermal cycling load
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Journal Articles
Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2020) 37 (4): 165–171.
Published: 03 September 2020
...Dongbo Li; Jianpei Wang; Bing Yang; Yongle Hu; Ping Yang Purpose This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly...
