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Keywords: Thermal shock
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Journal Articles
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2025) 42 (2): 18–27.
Published: 13 February 2025
...Yuan Peng; Shengli Hou; Weifeng Zhai; Xiaofeng Yang; Hao He; Xiaotong Guo Purpose This study aims to provide guidance for the reliability of electronic packaging. The reliability of solder joints at extremely temperature thermal shock is critical for electronic equipment operating in the field...
Journal Articles
Thermal shock and degradation of metallization systems on silicon
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2016) 33 (2): 102–106.
Published: 03 May 2016
...Arkady Skvortsov; Sergey Zuev; Marina Koryachko; Vadim Glinskiy Purpose The purpose of this study is to investigate the mechanisms of degradation of aluminum metallization under conditions of thermal shock caused by rectangular current pulses (amplitude j < 8 × 1010 A/m2...
