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Keywords: Thermodynamics
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Journal Articles
Thermodynamic aspect of the wire‐bonding process
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (1998) 15 (1): 23–31.
Published: 01 April 1998
... of dissipated process heat on the cold welding process of wire‐bonding. Complementary calculations to evaluate the equation of thermal conductivity were carried out using the finite element (FE) method. Bonding tests were able to verify the calculations. These thermodynamical considerations give us a new method...
