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Keywords: WLFO
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2023) 40 (2): 104–108.
Published: 30 September 2022
... and outsourced semiconductor assembly and testings have provided dozens of AIP samples (Wang, 2018 ; Yu , 2014, 2015), most of which used a wafer-level fan-out (WLFO) process based on silicon and compound wafer. On the one hand, low epsilon glass and laminate substrates were attractive choices for high...
