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Keywords: rtMLF
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Journal Articles
The advanced leadless leadframe package and its characteristics
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2023) 40 (2): 159–165.
Published: 16 February 2023
... flexibility to deploy signal, ground and power selectively. Design/methodology/approach In this study, the routable molded leadframe (rtMLF®) package applying the pre-resin MLF substrate was introduced. The structural advantages, in terms of design flexibility, were checked by adopting the specific...
