A simplified general purpose analytical finite element model has been developed to analyze the thermal performance of a continuous flow polymerase chain reaction (CPCR) microdevice. The corresponding governing differential equations along with the appropriate boundary conditions have been solved using a self‐developed code in Matlab®. Results obtained from the finite element simulations have been validated with available published results and also showed good agreement with those obtained from commercial FEA package, ANSYS®. The present methodology has an added advantage due to its flexibility where the unit cell of the finite element model can be arranged into different orientation for analyses of different CPCR microdevice configuration. In microchannel heat sinks, the results obtained agree well with the published result which demonstrates the flexibility and robustness of present methodology to be used for various applications.
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1 April 2009
Review Article|
April 01 2009
Thermal Analysis of a Continuous Flow Polymerase Chain Reaction Microdevice Using Analytical Finite Element Simulation Available to Purchase
Hing Wah Lee;
Hing Wah Lee
School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
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Ishak Abdul Azid;
Ishak Abdul Azid
School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
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Kankanhally Narasimha Seetharamu
Kankanhally Narasimha Seetharamu
Dean(R&D), Sri Bhagawan Mahaveer Jain College of Engineering, Jakkasandra Post, Kanakapura Taluk, Bangalore Rural District, 562112 India
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Publisher: Emerald Publishing
Online ISSN: 1573-6113
Print ISSN: 1573-6105
© Emerald Group Publishing Limited
2009
Multidiscipline Modeling in Materials and Structures (2009) 5 (4): 377–388.
Citation
Wah Lee H, Abdul Azid I, Narasimha Seetharamu K (2009), "Thermal Analysis of a Continuous Flow Polymerase Chain Reaction Microdevice Using Analytical Finite Element Simulation". Multidiscipline Modeling in Materials and Structures, Vol. 5 No. 4 pp. 377–388, doi: https://doi.org/10.1163/157361109789807954
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