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Keywords: Microelectronics packaging
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Journal Articles
Multidiscipline Modeling in Materials and Structures (2006) 2 (3): 309–326.
Published: 01 March 2006
... can not accurately account for the combined effect of both loadings acting concurrently. © Emerald Group Publishing Limited 2006 Finite element analysis Constitutive model Dynamic analysis Concurrent loading Microelectronics packaging Solder joints Multidiscipline Modeling in Mat...
