... bonds Power electronics The engineering task of microelectronics bonding for high temperature applications has been a substantial challenge for industry. In fact, there are many lead-free solder alloys available with relatively high operating temperatures, the practical consideration of using...

...Mohammad A. Gharaibeh; Jürgen Wilde Purpose The present paper aims to study the influence of the substrate system on the thermomechanical response of various lead-free die attach materials used in power electronics using nonlinear finite element simulations. Design/methodology/approach...