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Keywords: Thermo-mechanical stresses
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Journal Articles
Multidiscipline Modeling in Materials and Structures (2021) 17 (2): 451–464.
Published: 24 October 2020
... rights only Through-glass vias 2.5 D interposers Finite element analysis Substrate cracking Thermo-mechanical stresses CTE mismatch Energy release rate Interposer-based 2.5 D integration, where heterogeneous chips are stacked on an interposer substrate, is one of the most promising...
