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Keywords: Through silicon via
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Journal Articles
Multidiscipline Modeling in Materials and Structures (2024) 20 (1): 115–125.
Published: 02 January 2024
...Chongbin Hou; Yang Qiu; Xingyan Zhao; Shaonan Zheng; Yuan Dong; Qize Zhong; Ting Hu Purpose By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the upper surface protrusion...
