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Keywords: Through-glass vias
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Journal Articles
Multidiscipline Modeling in Materials and Structures (2021) 17 (2): 451–464.
Published: 24 October 2020
...Omar Ahmed; Chukwudi Okoro; Scott Pollard; Tengfei Jiang Purpose This study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration. Design/methodology/approach...
