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Keywords: Automotive
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Journal Articles
Journal:
PSU Research Review
PSU Research Review: An International Journal (2019) 3 (1): 70–83.
Published: 05 November 2018
... or moisture. Design/methodology/approach The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology. Findings...
