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Keywords: Solder bump
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Journal Articles
Journal:
PSU Research Review
PSU Research Review: An International Journal (2019) 3 (1): 70–83.
Published: 05 November 2018
... vehicle’s bonding diagram is shown in Figure 1 . The IMC growing thickness and analysis are summarized as following. T0 represents the bumped die joint to substrate with one time reflow only, and the sections for Ni-free pillar, Cu pillar and solder bump are shown in Figure 4 . The IMC thickness...
