Moisture‐curing reactive polyurethane hot‐melt adhesives

Describes the formulation of a hot‐melt polyurethane reactive (HMPUR) adhesive that is cured by moisture. Looks at the advantages of hot‐melt adhesives in general and reactive ones in particular. Further examines the properties of strength, resistance and flexibility for moisture curing reactive PUR hot melts and considerations in their use such as moisture availability, application equipment and thermal degradation. Finally, gives examples of real applications for HMPUR adhesives.