Devweld 534 ideal for difficult to bond substrates
Devweld 534 ideal for difficult to bond substrates
Latest in the series of structural adhesives being introduced to the UK market by Devcon UK,Wellingborough, is Devweld 534.
This methacrylate is a flexible filled adhesive designed for applications with difficult to bond substrates. It is characterised by having a reportedly excellent shear, peel and impact strength over a wide temperature range.
Stated to have non-sagging attributes and with a gap filling capacity of up to 9mm, the adhesive is believed to be an ideal repair product for use with a wide variety of flexible and semi flexible materials.
Devweld 534 is a gel-type,2-part methacrylate mixed in a 1:1 ratio. It claims a working time of 15 to 20 minutes, an open time of 10 to 15 minutes and a fixing time between 40 and 45 minutes.
The viscosity and flow properties of the adhesive are said to be ideal for robot meter-mix application. Non-sagging beads can be dispensed at very high speeds with moderate pressures through disposable static mixers.
Devcon claims that its methacrylate adhesives out-perform conventional bonding methods and enable engineers the freedom to design without the need for mechanical fastening.
Details from ITW Devcon,Brunnel Close, Park Farm Industrial Estate, Wellingborough, Northants NN8 6QX. Tel: 01933 675299; Fax: 01933 675765.
