Release behavior for powder injection molding in stereolithography molds Available to Purchase

Adhesion has been measured between a powder injection molded (PIM) part and the stereolithography epoxy mold surrounding it after cooling. Analysis of release behavior suggests a link to the thermal properties of the mold material. Subsequent measurements of cooling in the part and at the part/mold interface are consistent with a one‐dimensional heat transfer model. Adhesion development at the part/mold interface shows a complex dependence on the thermal characteristics of both the mold and the PIM feedstock.