Keywords: Electron beam melting
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Journal Articles
Journal Articles
Rapid Prototyping Journal (2018) 24 (8): 1401–1406.
Published: 16 October 2018
...Christopher Arnold; Christoph Pobel; Fuad Osmanlic; Carolin Körner Purpose The purpose of this study is the introduction and validation of a new technique for process monitoring during electron beam melting (EBM). Design/methodology/approach In this study, a backscatter electron detector...
Journal Articles
Journal Articles
Journal Articles
Rapid Prototyping Journal (2016) 22 (5): 801–809.
Published: 15 August 2016
.../methodology/approach For this study, samples of wall thickness varying between 4.0 and 0.25 mm were built in 304L on the selective laser melting (SLM) platform and Ti-6Al-4V on the electron beam melting (EBM) platform. Samples were then mechanically tested, and fractography was performed for analysis...
Journal Articles
Rapid Prototyping Journal (2016) 22 (3): 495–503.
Published: 18 April 2016
...Rebecca Klingvall Ek; Lars-Erik Rännar; Mikael Bäckstöm; Peter Carlsson Purpose The surface roughness of products manufactured using the additive manufacturing (AM) technology of electron beam melting (EBM) has a special characteristic. Different product applications can demand rougher or finer...
Journal Articles
Journal Articles
Rapid Prototyping Journal (2016) 22 (2): 322–329.
Published: 21 March 2016
...Dana H. Abdeen; Bruce R. Palmer Purpose This paper aims to evaluate the corrosion behavior of Ti-6Al-4V parts produced with electron beam melting (EBM) machine and compare it with wrought Ti-6Al-4V alloy. Design/methodology/approach Potentiodynamic and potentiostatic tests were applied on EBM...
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Journal Articles
Journal Articles
Journal Articles
Journal Articles
Rapid Prototyping Journal (2012) 18 (4): 259–263.
Published: 08 June 2012
... infrared images (IR) which were taken during the generation of Ti‐6Al‐4V parts in a selective electron beam melting system (SEBM) with metallographic images taken from destructive material investigation. Findings A good match is found between the IR images and the material flaws detected...
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