... short interconnections of the dies whilst reducing the complexity of wire bonded interconnections. For advanced image processing including image stabilisation, TSV enables a direct connection from each pixel to a dedicated circuit within an application specific integrated circuit (ASIC) mounted directly...

...Céline Filloy; G. Tessier; M. Bardoux; C. Filloy; C. Boué; D. Fournier Purpose Heating is a major cause of failure in integrated circuits. The authors have designed thermoreflectance‐based systems operating at various wavelengths in order to obtain temperature images. This paper aims to explore...

...C. Filloy; G. Tessier; S. Holé; G. Jerosolimski; D. Fournier Thermal phenomena that occur in operating integrated circuits can disturb their functioning and even cause failures. In order to prevent such dramatic issues, it is necessary to study these phenomena by developing high‐resolution thermal...

... of external components for many applications. CAE Aerospace industry Computer technology Data capture Data collection techniques Integrated circuits Precision engineering Sensors © MCB UP Limited 1996 Features Universal sensor interface chip (USIC): speci cation and applications outline...