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Keywords: Leadless package
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Journal Articles
Temperature compensation study of pressure sensors after leadless packaging
Available to Purchase
Journal:
Sensor Review
Sensor Review (2025) 45 (3): 339–347.
Published: 17 January 2025
... 02 01 2025 © Emerald Publishing Limited 2025 Emerald Publishing Limited Licensed re-use rights only Pressure sensor Leadless package Hardware compensation Resistance network compensation DSP compensation Joint compensation The traditional lead package uses the lead wire...
