... and finally techniques for producing graphene on silicon devices are discussed. Brief concluding comments are drawn. Findings – This shows that many physical and molecular sensors have been developed by combining nanomaterials with MEMS technology. These have been fabricated by a diverse range...

...Yih‐Chih Chiou; Jian‐Zong Liu; Yu‐Teng Liang Purpose The detection of invisible micro cracks (μ‐cracks) in multi‐crystalline silicon (mc‐si) solar wafers is difficult because of the wafers' heterogeneously textured backgrounds. The difficulty is twofold. First, invisible μ‐cracks must...

...P.M.Z. Hasan; Sheikh S. Islam; Tarikul Islam; Ameer Azam; Harsh Purpose The purpose of this paper is to present the dependence of capacitive sensing of organic vapours by porous silicon (PS) on its molecular structure for the realization of a organic vapour sensor, compatible with existing silicon...

...John Henry Sweet; David Hutson; Sandy Cochran; Anne Bernassau Purpose The purpose of this paper is to explore concepts and manufacturing issues for the emerging piezo on silicon technology being used in ultra‐sound devices. Development of 3D silicon‐on‐silicon structures is now under way...

...) silicon with improved yield and uniformity. Design/methodology/approach The method introduces discretization of the LPCVD polysilicon film using prior etching for the grid thus dividing each chip on the entire wafer. The selective etching of polysilicon for realizing of piezoresistors is limited...

... of a silicon mass and cantilever beam to aluminium nitride (AlN) or lead zirconate titanate (PZT) piezoelectric thin films deposited on the top of the cantilever and was fabricated using standard silicon micromachining techniques. Microgenerators fabricated with sol‐gel deposited PZT and sputtered AlN have...

...Klaus Schroeter Purpose This paper aims to discuss the new applications enabled by printed sensors. Design/methodology/approach The paper discusses how silicon‐based sensors are manufactured using the time‐consuming, expensive, and complicated fabrication process of traditional semiconductor...

... at the Berkeley Sensors and Actuators Centre Figure 3 The InvenSense dual‐axis MEMS gyro package Table I Design features of some commercial MEMS gyroscopes Silicon MEMS Gyroscopes are poised to become the next ultra‐high volume sensors application for MEMS technology...

...Andreas koschan; P.A. Alvi; B.D. Lourembam; V.P. Deshwal; B.C. Joshi; J. Akhtar Purpose To fabricate submicrometer thin membrane of silicon nitride and silicon dioxide over an anisotropically etched cavity in (100) silicon. Design/methodology/approach PECVD of silicon dioxide and Silcion...

... the same principle as the inertial sensor. Silicon Thermal measurement Measurement An inclinometer is a very sensitive accelerometer, used in low g applications for tilt measurements. Nowadays, inclinometers are widely used in various fields of applications such as: aviation...

... company structure, technology, products, markets and applications, including historical achievements and recent developments. Findings – This paper discusses the company's use of piezoelectric ceramic and microengineered silicon technologies in a range of high performance sensors for measuring shock...