Recent advances in epoxy curing agent technology for low temperature cure coatings Available to Purchase

Reports results from studies conducted on a polyfunctional amine adduct epoxy curing agent (EPI‐CURE DPC‐3293) as a means to design low temperature cure coatings. Through the judicious choice of epoxide resins and amine‐functional curing agents, relatively fast reaction rates and resistance to moisture and humidity are maintained under low‐temperature cure conditions, and that is evidenced by a good balance of performance properties of coating films. We have used differential scanning calorimetry (DSC) to study the extent of reaction as well as the glass transition temperatures (T_g). Electrochemical impedance spectroscopy (EIS) has been used to predict the barrier properties of coating films. These results are compared with epoxide resins cured with a phenalkamine curing agent to illustrate some of the unique advantages of using multifunctional amine adduct curing agents for the curing of epoxide resins under sub‐ambient cure conditions for a multitude of end‐use applications.