Fast electroless level-tin system
Fast electroless level-tin system
Keywords: Plating, Solderability, McGean Rohco, Environmental impact
The latest new product to be introduced from the recently launched Products Division of McGean-Rohco is an electroless tin plating solution, designed to benefit the PCB and SMT fabricator alike by reducing (eliminating) solderability problems.
Branded Replete ET-50, the new solution is said to be a stable, simple to use system capable of producing a uniform deposit on copper and copper alloy surfaces of 1.5 to 2.5 microns of tin. It claims fast immersion times, measured against alternative chemistry, and is thought to be relatively inexpensive compared to electroless nickel/gold and organo silver. High throughputs can be achieved in a conveyor operation. Replete ET-50 can also be used in traditional vertical process lines.
Used at a slightly elevated temperature to produce a deposit of 1 micron or better, it reportedly does not contain any sulphuric acid. It also removes lead from the manufacturing process in line with current global environmental policy for the new century. This is said to eliminate the heavy, corrosive filming found in other electroless tin solutions and any attack on solder mask or resists. The product also is said to inhibit the growth of inter-metallic layering by producing a flat dense deposit retaining good, long-term solderability (more than 12 months) and problem-free use as an etch resist in alkaline etchants.
Two other important benefits claimed are a much longer bath life when using Replete ET-50 and the elimination of dangerous powdered thiourea additions. Replete ET-50 chemistry means that waste treatment costs are thought to be simpler and lower than competitive systems.
Further details are available from McGean- Rohco (UK) Ltd. Tel: +44 (0) 1902 456563; Fax: +44 (0) 1902 457443; E-mail: sales@mcgean-rohco.co.uk
