The new immersion tin generation in practical operation – a surface finish process including the world's first organic metal Available to Purchase

This paper describes the properties of a new generation of immersion tin as a solderable surface finish for printed circuit boards. The new process combines the unique technology of Organic Metals with the well introduced technology of immersion tin. A comparison with other solderable surface finishes will show the advantages and superior performance for PCB manufacturer, assemblers and OEMs.