THERMOMAGNETIC ANALYSIS OF SEMICONDUCTOR DEVICES USING TRENDY

This paper describes the two‐dimensional numerical solution of the system of partial differential equations governing the carrier and heat transport in a semiconductor structure in the presence of a magnetic field. The model is based on a thermodynamic approach and it was implemented in the thermomagnetic module of 2D process/device simulator TRENDY. The influence of temperature gradients on the response of a magnetic field sensor is presented in the paper.