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Volume 10, Issue 4
1 April 1991
COMPEL - The international journal for computation and mathematics in electrical and electronic engineering Cover Image for Volume 10, Issue 4
Review Article| April 01 1991

BULK IMAGE EFFECTS OF PHOTORESIST IN THREE‐DIMENSIONAL PROFILE SIMULATION

Publisher: Emerald Publishing
Online ISSN: 2054-5606
Print ISSN: 0332-1649
© MCB UP Limited
1991
COMPEL (1991) 10 (4): 389–400.
https://doi.org/10.1108/eb051715

3D bulk image effects in high‐NA lens lithography are studied through 3D exposure and development simulations by applying a Mack model to the 3D exposure process.

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© MCB UP Limited
1991
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