IPC EXPO'99
IPC EXPO'99 14-18 March, Long Beach, California, USA: technical program preview
All tutorials will be held on Sunday, 14 March 1999, from 8.30 a.m. to 4.00 p.m. Half-day workshops will be held on Monday, 15 March from 9:00 a.m. to 12 noon, and 2:00 p.m. to 5:00 p.m.
Tutorials
T-01 Fundamentals of Printed Wiring Boards Joe Fjelstad, TesseraPWBs are the foundation of the electronic industry, providing the basis for most of today's electronic products. The Fundamentals of Printed Wiring Boards will address the basics of this rapidly evolving technology. Participants will be taken through the fabrication process step-by-step, and will leave the course with a thorough understanding of PWB manufacturing.
T-02 Design-through-Acceptance of Printed Boards (Using the IPC-A-600) Ralph Hersey, Ralph Hersey & AssociatesThe printed wiring board industry has long relied on the IPC-A-600 for its comprehensive coverage of PWB manufacturing standards. Participants will learn the rationale behind the document's specifications and how to use it to improve their quality and efforts and identify process problems behind rejectable product.
T-03 Troubleshooting the PWB Manufacturing Process Michael Carano, ElectrochemicalsConventional wisdom holds that as printed board complexity goes up, yields decrease. This tutorial will help fabricators avoid this fate. Every stage of the PWB process has its own set of variables, which affect the ultimate performance of the finished product. In this course, these variables will be identified and thoroughly explained, and the consequences of not properly controlling them will be explored.
T-04 Base Material Basics: The Manufacture and Market Doug Sober, IsolaUSAAll grades of base materials used for printed boards from low-cost, paper-based (FR-1) to high-speed/high-frequency PTFE are analyzed in-depth in this tutorial, along with an overview of current markets for these materials.
T-05 Microvias: Understanding Laser and Other Small Hole Technologies Alan Cable and Mark Owen, Electro Scientific Industries; Christopher Schreiber, Packard-Hughes InterconnectThis tutorial will contrast the generation of vias of 100 microns (0.004 inches) or less by mechanical punch, excimer laser and third and fourth harmonic of Nd: YAG lasers. Advantages, costs and limitations of the various systems will be presented and contrasted to plasma and conventional drilling processes. Via characterization platforms as well as examples of functional electronic modules utilizing microvias will also be shown.
T-06 Fabricating Advanced PWBs Using Build up Technologies Happy Holden, TechLead CorporationAs high density component packages come into common use, the need for advanced PWBs is essential. A number of innovative approaches to reducing the size, weight,thickness and cost of PWBs have recently been developed. This course will explore 16 of the most advanced PWB technologies used in the creation of interconnection systems for today's high performance electronic products.
T-07 Manufacturing and Reliability Issues of Small Diameter/High Aspect Ratio Plated through Holes and Vias Werner Engelmaier, Engelmaier Associates, Inc.Aspect ratio plated through holes and vias for high density electronic assemblies, high quality and yields as well as long-term reliability can be assured only by a deliberate design effort. Knowledge of the fatigue behavior of plated-through-hole (PTH)/via barrels and of what constitutes typical processing parameters and realistic use of environments are prerequisites for successful, high performance electronic assemblies.
T-08 Direct Wire Exposure Techniques for PCB Imaging: The History and Future Jeffrey Rittchier, ETEC SystemsInformation on the design,principles, manufacturing practices and practical applications of UV laser direct write exposure systems will be covered in this workshop. Participants will gain a working knowledge of the latest developments in laser direct imaging(LDI) and how to evaluate this technology for use in their own facilities. An analysis of cycle times, resist photosensitivity, and data rate limits will be included along with a discussion of LDI yield improvements for fine line imaging.
T-09 The Microvia Opportunity: Technology, Markets, and Applications Rolf Funer, AMP Circuits; Tom Sarnowski, AMP CircuitsMicrovias have been called the third revolution in printed circuitry, emerging non too soon to tackle demanding new designs and solving problems of old, inefficient designs. This workshop is designed to help the decision-making process on microvias both from a user and a manufacturer perspective.
T-10 Flexible Circuit Technology William Jacobi, Sheldahl; Thomas Stearns, Brander International ConsultantsOwing to its thinness, light weight, ability to fold, and variety of applications, flexible circuitry is fast becoming the interconnection solution for many of today's electronic products. This tutorial will focus on the manufacture, characteristics and end uses of flexible circuitry. New material options, such as adhesiveless flex, and their effect on costs and processing will be covered along with critical design issues.
T-11 Designing for Flexible Circuits Russ Griffith, Tyco Engineered Systems
T-12 High Speed Design: What Fabricators and Designers Need to Know Rick Hartley, Applied InnovationThis tutorial is a clear, in-depth study of the concepts and practices needed to successfully design and fabricate PCBs using the higher speed ICs of today and the very high speed devices of tomorrow.
T-13 Microvia and High Density Interconnect: Material Selection, Fabrication Process, and Design Guidelines Vern Solberg, TesseraThe primary obstacles in achieving higher density circuits are the limitations of mechanically drilled via holes and the thickness of dielectric materials typically used in the manufacture of multilayer circuits. Three of the most preferred techniques that have been developed to provide alternative interconnection between circuit layers are:laser, photo-defined and plasma-displacement. In this tutorial, the instructor will present detailed information and design guidelines for each of these technologies.
T-14 GenCAM Addresses High Density Circuit Boards Dieter Bergman, IPCNo longer can the industry deal with a condition where design and engineering is 100 percent complete, while the manufacturing processes, even with improved tools, are only 70 percent realized. GenCAM (which stands for generic computer-aided manufacturing) offers a standard solution to issues that have plagued the interface conditions between CAD and CAM. GenCAM can be used to build standard rigid or flexible printed boards as well as the new high-density boards that contain microvias and very fine conductors. This tutorial will explore the data transfer issues that surround the manufacture of advanced PWBs.
T-15 Wastewater Treatment Thomas H. Martin, Delta Chemicals and Equipment, Inc.Sponsored by the American Electroplaters and Surface Finishers Society (AESF), this workshop provides wastewater treatment operators with much of the knowledge necessary to become licensed operators. The basic chemistry principles that a wastewater treatment operator needs to know are covered, along with detailed information on commonly employed methods of meeting wastewater discharge standards.
Workshops
W-01 How to Purchase PWBs (9:00-12:00) Tom Macinski, IBMAs a buyer, knowing the basic steps in PWB manufacturing, the items that affect manufacturability and cost, the current world market, and the factors in forging a good customer/supplier relationship can improve the profitability of your company. This course provides a thorough understanding of the PWB procurement process, and explores the issues affecting PWB costs.
W-02 Design of Experiments (2:00-5:00) Peter Turney, Cost TechnologyActivity based costing is today's number one tool for finding and exploiting the hidden opportunities to improve profit performance. It helps PCB manufacturers focus on profitable products and customers, and remove cost from production,administrative, and engineering processes. Using examples from actual experience, this workshop describes an implementation method specifically designed to work in the PCB environment.
W-03 Total Quality Management: The Secrets (and Experience) of Building Real Teams (9:00-12:00) Dave Dibble, LinDave ManagementThis program will show how companies can break out of the paradigm of solitary work to create real terms that add real value to their organizations. The course will explain why people do not normally work well together and how to impart the concept of teamwork to all employees. Attendees will learn the hallmarks of great teams and the benefits their synergy will bring to a company.
W-04 Proactive Management in a Changing World (2:00-5:00) Dave Dibble, LinDave ManagementIn this workshop,participants will explore the keys to dealing with and creating rapid change in their organizations and work groups. The course will include segments on identifying barriers to change and successfully break through those barriers using a systematic approach.
W-05 The Case for Computer Integrated Manufacturing (9:00-12:00) Mehul Dave, Cimnet SystemsThe bottleneck in PCB manufacturing has traditionally been production. Now, information is the bottleneck. Management now more than ever before must utilize information technology to maximize its return on invested capital. This workshop makes the case for computer integrated manufacturing (CIM) as a tool for gaining a sustainable competitive edge.
W-06 Variability Reduction Using Statistical Process Control (2:00-5:00) Marti Tully, Stickley-Vejar PWB Technical ServicesIt is possible to improve on the PWB manufacturing process using various statistical process control techniques. Its four basic steps include measuring the process, eliminating variances in the process to make it uniform, monitoring the process and developing the process to its best target value. Managers often shy away from statistical analysis because they do not understand the language or the mathematics used by statisticians. This session is designed as a simple, hands-on course in applied statistical methods: problem solving and capability studies/charting.
W-07 High Density Base Material Alternatives (Part 1) (9:00-12:00) Doug Sober, IsolaUSAFor nearly 15 years,CEM-1 was used for consumer applications, polyamide was the material of choice for military/aerospace and FR-4 was utilized for everything else. Today, with the focus on high density PWBs, there are new materials being developed at a rapid pace to satisfy the needs of high density interconnect structures (HDIS). This workshop will focus on the performance characteristics and manufacture of some of these new materials.
W-08 High Density Base Material Alternatives (Part 2) (2:00-5:00) Erik Bergum, Polyclad LaminatesThis workshop will focus on un-reinforced materials being used in high density interconnect structures (HDIS). As an emerging sea of technologies, the materials used cover a wide spectrum of traditional to new and unconventional. Resin coated foils, non-wovens, films and other variations will be discussed. Information on thermal, electrical and mechanical performance of these materials as it relates to PWB processing will also be presented.
W-09 Final Finishes (9:00-12:00) Michael Carano, ElectrochemicalsSolderability. Bondability. Every PWB manufacturer must provide product to its assemblers with a variety of final finishes. This workshop will provide an overview of the various final finishes,including hot air solder leveling. Advantages and disadvantages along with typical operating parameters, both chemical and mechanical, will be presented. Where appropriate, control procedures designed to maintain processes in optimum condition will be addressed.
W-10 Direct Metallization Technology (2:00-5:00) Michael Carano, ElectrochemicalsThis workshop will provide a thorough understanding of the reliability issues associated with the metallization of plated through-hole printed wiring boards. Most importantly,fabricators, assemblers and end-users need to understand the technological shift in metalizing through hole printed wiring boards utilizing direction metallization processes in place of conventional electroless copper technology.
W-11 Laser Materials Processing (9:00-12:00) Ronald Schaeffer, Photo MachiningThis course is designed to provide background information essential to understanding lasers and their uses in the microelectronics industry. The course will review basic laser physics and photon/materials interactions and will also review basic beam delivery techniques, motion control and part handling. Several applications will be discussed in detail including microvia drilling, flexible circuit dielectric removal, board repair, photoresist removal and patterning, and wire stripping.
W-12 Up to Speed with Laser Direct Imaging (2:00-5:00) Warren Wynne, E.I. Du Pont de Nemours
W-13 Traditional Bareboard Electrical Test Strategies (9:00-12:00) Robert Hanson, AmeriCom ServicesIn today's high density, fin line, SMT environment, the bare board is becoming the most critical element in the product design. A new set of issues now surrounds the testing of blind and buried vias and high density routing. Intelligent bare board testing to ensure a functional, cost competitive manufacturing operation will be discussed in this workshop.
W-14 Testing HDI/Emerging Packaging Bareboards (2:00-5:00) Robert Hanson, AmeriCom ServicesToday's HDI printed circuit board defies conventional testing strategies. This course covers testing issues of BGAs, CSP, FC, COB, and TAB footprints along with test issues of m via, blind/buried vias, imbedded Rs and Cs, distributive C, and HDIs; pros/cons of HASL versus OSP, Au, Sn, and Ag finishes regarding pins/probes; test issues of flying probe (FP) testers: accuracy, speed, types, C test, voltage charge/discharge, vision, and issues of integrating FP with traditional BONs testers; and new tester innovations: BON Xfer, Thermal, OSEE, E Field, E Beam voltage/switch grid and testing speed.
W-15 Practical Aspects of Implementing Microvia Manufacturing (9:00-12:00) Russell Smith, Ciba Specialty ChemicalsThe path to finer lines and smaller holes is not an easy one. This workshop will highlight those processes necessary to produce successfully microvia printed circuit boards. The major focus will be on wet processes and possible roadblocks to acceptable quality levels. A generous portion of time will be reserved to discuss specific attendee problems and questions during the session.
W-16 Sequential Electrochemical Reduction Analysis (SERA) (2:00-5:00) Peter Bratin, ECI; David Hillman, Rockwell InternationalThe use of Sequential Electrochemical Reduction Analysis (SERA) methodology is a recent development within the electronics industry for characterizing and understanding metallic surface conditions. As part of the course, a group of SERA users representing different current industry applications will discuss participants' specific issues concerning SERA application and realted surface finish problem resolutions.
W-17 Advanced Tools for PWB Testing and Failure Analysis (9:00-12:00) Bob Neves, Microtek LaboratoriesMost PWB testing conducted today is in the conformance and failure analysis areas. This session will discuss the advanced test tools available today, and the emerging test technology for the future. The session will also cover the benefits of test data provided by electrical and environmental tests, surface analysis techniques, and organic material identification.
W-18 PWB Microsectioning Essentials (2:00-5:00) Joe Tuchton, Lockheed MartinMicrosection analysis can be a powerful tool in quality evaluation whether you manufacture or use PWBs. This workshop will cover several different microsectioning techniques and will also provide many visual examples of board defects revealed by microsectioning.
W-19 Introduction to Surface Mount Technology (9:00-12:00) Ray Prasad, Prasad Consulting GroupAn effective implementation of surface mount technology (SMT) is the result of engineers recognizing the interdependency of design and manufacturing for higher yield,lower cost and faster time to market. This course will identify the technical challenges of SMT, BGA and fine pitch technology design and manufacturing that must be faced at every stage of the production process.
W-20 Ball Grid Array: Principles and Practices (2:00-5:00) Ray Prasad, Prasad Consulting GroupBall grid array (BGA)Technology has so many benefits: real estate savings, high yield, and better electrical performance. Despite these, there are many problems with implementing a leading edge technology such as BGA. This workshop will identify the critical design, manufacturing, and technical issues surrounding BGA. Different BGA types, their advantages and disadvantages will be explored as well as how to effectively implement this exciting innovation.
W-21 CSP, BGA and Fine Pitch Peripheral Interconnections (9:00-12:00) Jennie Hwang, H-TechnologiesAs the trend of IC technology proceeds toward increasing I/O counts and shrinking circuitry line, IC package architectures peripheral (fine pitch QFP), array (BGA) and chip scale packages (CSP) become increasingly important. The materials and processes required for these types of packages are most demanding. They are critical to the quality, yield and overall performance and reliability of the circuit assemblies in electronic products. The objective of the course is to provide participants with an overview of CSP, BGA and fine pitch QFP.
W-22 Lead Solderability and PCB Surface Finishes (2:00-5:00) Jennie Hwang, H-TechnologiesThis course will discuss the characteristics of component leads made of copper, Alloy 42 and KOVAR coated with Sn/Pb, Pd/Ni, Pd, Au in relation to solderability. The course will provide an understanding of solderability on various metallic and organic surface finishes from both chemical and metallurgic perspectives; will compare the various material and process options in order to facilitate the selection between metallic and organic coated PCBs.
W-23 Acceptability of Electronic Assemblies (Using the IPC-A-610B) (9:00-12:00) Constantino Gonzalez, ACME Corp.The document on which this workshop is based, the IPC-A-610, is the most popular standard IPC has ever published. This workshop will cover the critical areas of IPC-A-610 such as surface mounting and soldered connection requirements and look ahead to changes in the upcoming revision C. This course will give OEM purchasing managers, assembly process engineers, and others involved with inspection and essential overview of assembly acceptability guidelines.
W-24 Printed Circuit Board Repair (Using IPC-7721) (2:00-5:00) Bill Butman and Jeff Ferry, Circuit Technology CenterThe newly-published IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies provides industry accepted procedures for critical bare board repairs, such as lifted lands, damaged edge contacts, and crack plated through holes. This workshop will use live demonstrations and computer generated, full-color video graphics to give participants a first-hand look at the repair techniques illustrated in the guideline.
W-25 Design for Profit (9:00-12:00) Dick Dunlop, General Atomics Aeronautical Systems, Inc.By now, everyone knows about all the "Designs for ..." courses. But do designers and managers know if they should be designing in the first place? What their projected design costs are for extra features or what alternatives could reduce it by 10 percent?Today, you cannot afford to go back and "value engineer" after product launch. You need to predict a competitive edge not hope for one. This workshop is a general summary of the methods and techniques used by to determine whether you have designed for profit.
W-26 EMI Shielding (2:00-5:00) Rick Hartley, Applied InnovationWhen a time varying (AC) current flows in a wire or conductor, both an electric field and a magnetic field are present. These fields are the cause of both EMI and cross-talk. Gaining an understanding of what generates these fields and how to control them and their effects will take EMI and cross-talk control from "guess work" to basic"everyday practice".
W-27 Controlled Impedance Design of Printed Wiring Circuits (9:00-12:00) Lee Ritchey, 3COMNew electronic products are being designed for higher performance. Interconnection density and signal speed increase, the electrical properties of the system, are seriously affected. PWB transmission lines, which steer the electromagnetic waves associated with the transmission signals within the system, must protect the printed wiring circuit from cross-talk as well as conductor and dielectric losses. This workshop will introduce and explain how these transmission lines are designed, and how they influence PWB fabrication.
W-28 Mixed Signal Design (2:00-5:00) Lee Ritchey, 3COMAll areas of concern in mixed signal design are covered in this workshop, including mixing analog with digital as well as mixing different logic families on the same PCB or system. Answers to critical questions will provide designers and fabricators with the knowledge necessary to involve diverse technologies and still create an economical,properly functioning PCB.
W-29 Design Principles and PCB Layout Guidelines for BGA, CSP Packages (9:00-12:00) Vern Solberg, TesseraBGA Packaging is seen by many as a viable answer to the space restrictions of newer generations of high performance, hand-held and portable electronic products. This workshop will cover ball grid array packaging methodology, standards, review typical BGA applications, outline environmental qualification requirements and study land pattern geometry alternatives, circuit routing guidelines as well as important factors related to high density PCB fabrication technologies.
W-30 Stepping up to Flex: Bringing Flexible Circuitry to your PWB Facility Joe Fjelstad, TesseraDue to their exceptional versatility, flex circuits have become one of the fastest growing areas of electronic interconnection fabrication technology. Increasing numbers of circuit designers and packaging engineers are seeking to employ flex circuits in their applications. This workshop will explore the differences and commonalties between rigid and flex manufacture in terms of process, materials,and equipment requirements.
