Schlenk Metallfolien offers Cu-treated copper foils down to a thickness of 0.010mm (0.0004)
Schlenk Metallfolien offers Cu-treated copper foils down to a thickness of 0.010mm (0.0004)
Keywords: Schlenk Metallfolien, Foil, Copper
Smaller, lighter, more efficient electronic devices present challenges to producers of flexible circuits. Schlenk Metallfolien GmbH & Co KG has responded to the needs of lamination industries and the electronics industries for thinner circuitry, by offering ultra thin copper foils with a Cu-treatment,either on one side or on both sides. The physical properties of these foils increase the flexibility and life cycle, even in exceptional constructions.
Schlenk Metallfolien offers foils with a thickness of 0.010mm (0.0004") the thinnest available rolled copper foil with a Cu-treatment. By using such a low foil thickness, the producers of base materials for flexible circuits can realize an advantage of more than 40 per cent in thickness or weight, compared with the currently used standard thickness of 0.017mm (1/2 oz.).
Specialist knowledge in production of ultra thin foils and Cu-Treatment have now been combined under one roof at Schlenk Metallfolien. Due to the recent acquisition of technology and production know-how from a leading European finishing company, Schlenk Metallfolien is now the only European producer of thin rolled foil with Cu-treatment, single- or double-sided. Their Cu-treated foils made from specially selected high purity copper are manufactured to meet IPC-standards. The high conductivity of 100.0 to 101.5 per cent IACS (at 68°F;for foils in a soft temper) means high heat dissipation. The low profile and uniform treatment enhances the bonding strength of laminates.
In 2000, additional production halls will be completed, to meet a scheduled increase in production capacity. For further information please visit Schlenk on booth # 631 or see: www.schlenk.de
