Blowholing in PTH Solder Fillets: Part 1 Assessment of the Problem Available to Purchase

This paper introduces a series of eight describing the research work undertaken into the most pervasive of quality assurance problems in the mass soldering of plated‐through‐hole (PTH) printed circuit boards, namely the occurrence of voids and blowholes in the solder fillets. The research programme has been carried out at NPL with advice and practical involvement of members of the Soldering Science and Technology Club whose contributions have played a large part in its successful outcome. The work has led to an understanding of the mechanisms giving rise to this problem and recommendations for production procedures to fully control it. In this first paper, results are presented of a UK‐wide survey of the electronics assembly industry and of the assessment made regarding the extent, the harmfulness and the cost of the problem of voids and blowholes.