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A combination of analytical methods was used on printed circuit board coupons to conclude the following: (1) while steam ageing deteriorates solderability of tinned coupons, it does not increase the oxide thickness or tin‐lead ratio of the surface (top 50 Angstroms) of tinned coupons; (2) therefore, some other factor, probably oxidation of the copper or tin/copper intermetallic substrate, determines solderability of the coupons.
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© MCB UP Limited
1991
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