Solderability Changes of Printed Wiring Board Surfaces during Electronic Assembly Operations

Today's electronic assembly manufacturing operations can be complex combinations of process steps such as IR reflow, wave soldering, special soldering of connectors or sensitive components, cleaning, rework, etc. Such multiple exposures to elevated temperatures and/or oxidising environments (e.g., aqueous cleaning) can have a negative effect on the solderability of printed wiring board (PWB) surfaces. This in turn may limit the effectiveness of subsequent soldering operations, such as wave soldering following an IR reflow step. The purpose of this study is to assess the impact of individual assembly process steps on the solderability of PWB surfaces. The PWB surfaces are initially treated with protective coatings of benzotriazole (BTA). The process steps investigated include: IR reflow in air and in nitrogen; vapour phase reflow; aqueous cleaning; adhesive cure; and wave soldering as a function of solder temperature and flux type. Meniscograph wettability testing is used to measure relative solderability changes, and Auger electron spectroscopy (AES) is used to monitor surface chemical changes, particularly oxide formation. The overall result is a body of fundamental information providing insight into optimisations of process flows, equipment operating specifications, process temperatures and selection of flux types.