Earlycite

Retraction Notice July 28 2026
Retraction notice: Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-07-2026-0055
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Research Article June 15 2026
Influence of electron irradiation on the power cycling lifetime of SiC MOSFETs
Yuxiong Xue; Jiayan Li; Bo Mei; Zhichao Wei; Zicai Shen; Liming Gu; Teng Zhang; Weixiang Zhou; Hanxun Liu; Dan Han; Rongxing Cao
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-03-2026-0027
View articletitled, Influence of electron irradiation on the power cycling lifetime of SiC MOSFETs
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Research Article June 10 2026
Mechanical response of BGA micro solder joints with different shape combinations under thermal cycling
Xiangxia Kong; Zuchen Liu; Lu Yang; Ruipeng Ma; Junjun Zhai
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-01-2026-0003
View articletitled, Mechanical response of BGA micro solder joints with different shape combinations under thermal cycling
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Research Article June 3 2026
Reliability study of large-area sintered Cu for power electronic packaging
Yi Xie; Jian Huang; Daoguo Yang; Miao Cai; Hongbo Qin; Zhi Liang
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-03-2026-0020
View articletitled, Reliability study of large-area sintered Cu for power electronic packaging
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Research Article May 21 2026
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
Zhuo Chen; Zhiheng Luo; Junqin Zhang; Jie Li; Mingyu Gao; Qin Che; Jiayi Zhang
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-12-2025-0078
View articletitled, Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
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Literature Review May 21 2026
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
Muhammad Nubli Zulkifli
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-03-2026-0018
View articletitled, Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
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Research Article May 19 2026
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation
Ce Zeng; Yanming Zhang; Mingqi Gao; Can Sheng; Dongyang Lei; Yang Li; Yangyang Li; Zhenduo Cui; Shengli Zhu
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-03-2026-0017
View articletitled, AI-Driven cross-scale modeling for SiP thermo-mechanical simulation
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Research Article May 1 2026
Reliability analysis for heterogeneous millimeter-wave RF front-end package using a hybrid FEA-machine learning model
Lichang Huang; Yingjun Zhang; Yuting Tong; Xiaobin Xu; Jinxing Chen; Sha Xu; Yu Zhang
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-11-2025-0072
View articletitled, Reliability analysis for heterogeneous millimeter-wave RF front-end package using a hybrid FEA-machine learning model
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Research Article April 8 2026
Reliability study of hybrid bonded structures based on flux divergence method
Yukang Wang; Wumiao Gan; Daokuan Tang; Yaoting Wang; Yiying Zhu; Zhukun Zhou
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-11-2025-0073
View articletitled, Reliability study of hybrid bonded structures based on flux divergence method
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Research Article April 7 2026
A comparative study of the mechanical properties of sintered submicron and micron Cu
Jian Huang; Bi Wang; Siliang He; Miao Cai; Hongbo Qin; Haidong Yan
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-11-2025-0069
View articletitled, A comparative study of the mechanical properties of sintered submicron and micron Cu
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Research Article April 6 2026
Effects of electron irradiation and thermal cycling on electrical properties of GaN HEMT
Dan Han; Xiao Chen; Zicai Shen; Rui Chen; Rongxing Cao; Yang Liu; Hanxun Liu; Yuxiong Xue
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-11-2025-0063
View articletitled, Effects of electron irradiation and thermal cycling on electrical properties of GaN HEMT
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Research Article February 9 2026
Comparative analysis of the fatigue life of the FLASH under joint error conditions
Le Lei; Bing Lei; Lingbo Li
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-11-2025-0064
View articletitled, Comparative analysis of the fatigue life of the FLASH under joint error conditions
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Research Article February 3 2026
Investigation on the effect of die-attaching on the mechanical properties and microstructure of nano-Cu sintered joints
Quanyi Liu; Zhicheng Ding; Hongsheng Sun; Biao Liu; Yang Liu
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-11-2025-0070
View articletitled, Investigation on the effect of die-attaching on the mechanical properties and microstructure of nano-Cu sintered joints
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Research Article January 27 2026
Effects of Sn grain orientation and microbump geometry on thermomigration failure in microbump joints
Chu Tang; Zhuo Chen; Wenhui Zhu
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-10-2025-0051
View articletitled, Effects of Sn grain orientation and microbump geometry on thermomigration failure in microbump joints
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Research Article January 22 2026
Study of the bonding force at the Au-Ag bump/TiW interface in wire bonding
Bo-Wen Cai; Jia-Qi Wang; Qi Zhang; Li-Yin Gao; Changyou Ren; Zhi-Quan Liu
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-11-2025-0067
View articletitled, Study of the bonding force at the Au-Ag bump/TiW interface in wire bonding
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Research Article January 20 2026
Synergistically promoted direct bonding of nanotwinned copper at 200 °C viareductive solvents
Zehao Zhao; Wei Wu; Li-Yin Gao; Zhi-Quan Liu
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-11-2025-0066
View articletitled, Synergistically promoted direct bonding of nanotwinned copper at 200 °C viareductive solvents
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Literature Review January 1 2026
Directional transfer and low-temperature interconnect packaging of nano metal materials
Siyu Chen; Deyi Chen; Yiqian Huang; Ruijie Liu; Xinyuan Wang; Ben Tian; Jianming Xu; Yun Mou
Soldering & Surface Mount Technology (2026) https://doi.org/10.1108/SSMT-10-2025-0053
View articletitled, Directional transfer and low-temperature interconnect packaging of nano metal materials
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