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Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder

Jiamin Zhang, Liang Zhang, Xi Huang, Chuanjiang Wu, Kai Deng, Wei-Min Long

Soldering & Surface Mount Technology (2025) 37 (1): 60–70.

https://doi.org/10.1108/SSMT-09-2024-0053

Published: 20 November 2024

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Influence of doping Si₃N₄ nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate

Kai Deng, Liang Zhang, Chen Chen, Xiao Lu, Lei Sun, Xing-Yu Guo

Soldering & Surface Mount Technology (2025) 37 (2): 97–107.

https://doi.org/10.1108/SSMT-10-2023-0060

Published: 15 February 2024

View article titled, Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate

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Effect of Si₃N₄ nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding

Chen Chen, Liang Zhang, Xi Huang, Xiao Lu

Soldering & Surface Mount Technology (2024) 36 (1): 8–19.

https://doi.org/10.1108/SSMT-07-2023-0037

Published: 22 September 2023

View article titled, Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding

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Stress analysis and structural optimization of 3-D IC package based on the Taguchi method

Ming-Yue Xiong, Liang Zhang, Peng He, Wei-Min Long

Soldering & Surface Mount Technology (2020) 32 (1): 42–47.

https://doi.org/10.1108/SSMT-04-2019-0016

Published: 13 August 2019

View article titled, Stress analysis and structural optimization of 3-D IC package based on the Taguchi method

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Journal Articles

Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

Liang Zhang, Zhi-quan Liu, Fan Yang, Su-juan Zhong

Soldering & Surface Mount Technology (2017) 29 (3): 151–155.

https://doi.org/10.1108/SSMT-07-2016-0015

Published: 05 June 2017

View article titled, Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

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Journal Articles

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

Peng Xue, Song‐bai Xue, Liang Zhang, Yi‐fu Shen, Li‐li Gao, Sheng‐lin Yu, Hong Zhu, Zongjie Han, Yan Chen

Soldering & Surface Mount Technology (2011) 23 (3): 177–183.

https://doi.org/10.1108/09540911111146935

Published: 28 June 2011

View article titled, Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

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Journal Articles

Effects of bulk Cu₆Sn₅ intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

Liang Zhang, Song‐bai Xue, Li‐li Gao, Zhong Sheng, Wei Dai, Feng Ji, Huan Ye, Yan Chen, Sheng‐lin Yu

Soldering & Surface Mount Technology (2011) 23 (1): 4–9.

https://doi.org/10.1108/09540911111099640

Published: 08 February 2011

View article titled, Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

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Journal Articles

Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

Guang Zeng, Songbai Xue, Liang Zhang, Zhong Sheng, Lili Gao

Soldering & Surface Mount Technology (2010) 22 (4): 57–64.

https://doi.org/10.1108/09540911011076899

Published: 21 September 2010

View article titled, Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

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Journal Articles

Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium

Liang Zhang, Song-bai Xue, Li-li Gao, Yan Chen, Sheng-lin Yu, Zhong Sheng, Guang Zeng

Soldering & Surface Mount Technology (2010) 22 (2): 30–36.

https://doi.org/10.1108/09540911011036262

Published: 13 April 2010

View article titled, Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium

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Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder

Influence of doping Si₃N₄ nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate

Effect of Si₃N₄ nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding

Stress analysis and structural optimization of 3-D IC package based on the Taguchi method

Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

Effects of bulk Cu₆Sn₅ intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium

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