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Journal Articles

Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder

Jiamin Zhang, Liang Zhang, Xi Huang, Chuanjiang Wu, Kai Deng, Wei-Min Long

Soldering & Surface Mount Technology (2025) 37 (1): 60–70.

https://doi.org/10.1108/SSMT-09-2024-0053

Published: 20 November 2024

View article titled, Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder

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Journal Articles

Stress analysis and structural optimization of 3-D IC package based on the Taguchi method

Ming-Yue Xiong, Liang Zhang, Peng He, Wei-Min Long

Soldering & Surface Mount Technology (2020) 32 (1): 42–47.

https://doi.org/10.1108/SSMT-04-2019-0016

Published: 13 August 2019

View article titled, Stress analysis and structural optimization of 3-D IC package based on the Taguchi method

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