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Journal Articles

Reliability study of large-area sintered Cu for power electronic packaging

Yi Xie, Jian Huang, Daoguo Yang, Miao Cai, Hongbo Qin, Zhi Liang

Soldering & Surface Mount Technology 1–11.

https://doi.org/10.1108/SSMT-03-2026-0020

Published: 03 June 2026

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Journal Articles

A comparative study of the mechanical properties of sintered submicron and micron Cu

Jian Huang, Bi Wang, Siliang He, Miao Cai, Hongbo Qin, Haidong Yan

Soldering & Surface Mount Technology 1–11.

https://doi.org/10.1108/SSMT-11-2025-0069

Published: 07 April 2026

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Journal Articles

Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles

Hongbo Qin, Quanzheng Tan, Jian Huang, Bi Wang, Shaohao Zhu, Miao Cai, Yao Zhu, Xiaohui Zhao, Can Yin, Kailin Pan, Wangyun Li

Soldering & Surface Mount Technology (2025) 37 (4): 320–332.

https://doi.org/10.1108/SSMT-01-2025-0001

Published: 23 April 2025

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