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Journal Articles
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles
Available to PurchaseHongbo Qin, Quanzheng Tan, Jian Huang, Bi Wang, Shaohao Zhu, Miao Cai, Yao Zhu, Xiaohui Zhao, Can Yin, Kailin Pan, Wangyun Li
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (4): 320–332.
Published: 23 April 2025
