Yang Liu
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Journal Articles

Effects of electron irradiation and thermal cycling on electrical properties of GaN HEMT

Dan Han, Xiao Chen, Zicai Shen, Rui Chen, Rongxing Cao, Yang Liu, Hanxun Liu, Yuxiong Xue
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–11.
https://doi.org/10.1108/SSMT-11-2025-0063
Published: 06 April 2026
View article titled, Effects of electron irradiation and thermal cycling on electrical properties of GaN HEMT
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Journal Articles

Investigation on the effect of die-attaching on the mechanical properties and microstructure of nano-Cu sintered joints

Quanyi Liu, Zhicheng Ding, Hongsheng Sun, Biao Liu, Yang Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–11.
https://doi.org/10.1108/SSMT-11-2025-0070
Published: 03 February 2026
View article titled, Investigation on the effect of die-attaching on the mechanical properties and microstructure of nano-Cu sintered joints
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Journal Articles

Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints

Mengxia Jiang, Yang Liu, Yuxiong Xue, Guangbao Shan, Jun Lv, Mairui Huang
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (4): 239–251.
https://doi.org/10.1108/SSMT-03-2024-0014
Published: 25 July 2024
View article titled, Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints
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Journal Articles

Temperature and current density prediction in solder joints using artificial neural network method

Yang Liu, Xin Xu, Shiqing Lv, Xuewei Zhao, Yuxiong Xue, Shuye Zhang, Xingji Li, Chaoyang Xing
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (2): 80–92.
https://doi.org/10.1108/SSMT-07-2023-0040
Published: 04 December 2023
View article titled, Temperature and current density prediction in solder joints using artificial neural network method
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Journal Articles

Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage

Meng Jiang, Yang Liu, Ke Li, Zhen Pan, Quan Sun, Yongzhe Xu, Yuan Tao
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (1): 1–7.
https://doi.org/10.1108/SSMT-12-2022-0061
Published: 27 November 2023
View article titled, Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage
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Journal Articles

Numerical simulation of reliability of single-sided/double-sided package interconnect structure under temperature cyclic load

Shuo Huang, Yang Liu, Ke Li
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (1): 35–43.
https://doi.org/10.1108/SSMT-12-2021-0066
Published: 31 May 2022
View article titled, Numerical simulation of reliability of single-sided/double-sided package interconnect structure under temperature cyclic load
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Journal Articles

Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints

Meng Xu, Fenglian Sun, Zhen Pan, Yang Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (1): 1–8.
https://doi.org/10.1108/SSMT-07-2021-0044
Published: 14 April 2022
View article titled, Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints
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Journal Articles

Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints

Yang Liu, Yuxiong Xue, Min Zhou, Rongxing Cao, Xianghua Zeng, Hongxia Li, Shu Zheng, Shuang Zhang
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2022) 34 (3): 153–161.
https://doi.org/10.1108/SSMT-08-2021-0052
Published: 01 November 2021
View article titled, Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints
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Journal Articles

Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding

F Sun, Zhen Pan, Yang Liu, Xiang Li, Haoyu Liu, Wenpeng Li
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (5): 274–280.
https://doi.org/10.1108/SSMT-10-2020-0047
Published: 14 May 2021
View article titled, Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding
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Journal Articles

Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging

Bangyao Han, Fenglian Sun, Tianhui Li, Yang Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (2): 57–64.
https://doi.org/10.1108/SSMT-04-2019-0015
Published: 03 October 2019
View article titled, Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging
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Journal Articles

Stress analysis of pressure-assisted sintering for the double-side assembly of power module

Yang Liu, Hao Zhang, Lingen Wang, Xuejun Fan, Guoqi Zhang, F. Sun
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (1): 20–27.
https://doi.org/10.1108/SSMT-01-2018-0005
Published: 18 February 2019
View article titled, Stress analysis of pressure-assisted sintering for the double-side assembly of power module
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Journal Articles

Growth kinetics of IMC at the solid Cu/liquid Sn interface

Zuozhu Yin, Fenglian Sun, Yang Liu, Yang Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (3): 145–152.
https://doi.org/10.1108/SSMT-02-2017-0004
Published: 14 February 2018
View article titled, Growth kinetics of IMC at the solid Cu/liquid Sn interface
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Journal Articles

Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint

Gaofang Ban, Fenglian Sun, Yang Liu, Shaonan Cong
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 92–98.
https://doi.org/10.1108/SSMT-06-2016-0013
Published: 03 April 2017
View article titled, Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint
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Journal Articles

High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method

Xiangxia Kong, F. Sun, Miaosen Yang, Yang Liu
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (3): 167–174.
https://doi.org/10.1108/SSMT-01-2016-0001
Published: 06 June 2016
View article titled, High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method
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