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Journal Articles

Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage

Meng Jiang, Yang Liu, Ke Li, Zhen Pan, Quan Sun, Yongzhe Xu, Yuan Tao

Soldering & Surface Mount Technology (2024) 36 (1): 1–7.

https://doi.org/10.1108/SSMT-12-2022-0061

Published: 27 November 2023

View article titled, Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage

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Journal Articles

Numerical simulation of reliability of single-sided/double-sided package interconnect structure under temperature cyclic load

Shuo Huang, Yang Liu, Ke Li

Soldering & Surface Mount Technology (2023) 35 (1): 35–43.

https://doi.org/10.1108/SSMT-12-2021-0066

Published: 31 May 2022

View article titled, Numerical simulation of reliability of single-sided/double-sided package interconnect structure under temperature cyclic load

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