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Journal Articles

Microstructure evolution and shear strength of full Cu₃Sn- microporous copper composite joint by thermo-compression bonding

F Sun, Zhen Pan, Yang Liu, Xiang Li, Haoyu Liu, Wenpeng Li

Soldering & Surface Mount Technology (2021) 33 (5): 274–280.

https://doi.org/10.1108/SSMT-10-2020-0047

Published: 14 May 2021

View article titled, Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding

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Journal Articles

Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding

Mengjiao Guo, F. Sun, Zuozhu Yin

Soldering & Surface Mount Technology (2019) 31 (4): 227–232.

https://doi.org/10.1108/SSMT-08-2018-0025

Published: 13 May 2019

View article titled, Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding

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Journal Articles

Stress analysis of pressure-assisted sintering for the double-side assembly of power module

Yang Liu, Hao Zhang, Lingen Wang, Xuejun Fan, Guoqi Zhang, F. Sun

Soldering & Surface Mount Technology (2019) 31 (1): 20–27.

https://doi.org/10.1108/SSMT-01-2018-0005

Published: 18 February 2019

View article titled, Stress analysis of pressure-assisted sintering for the double-side assembly of power module

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Journal Articles

High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method

Xiangxia Kong, F. Sun, Miaosen Yang, Yang Liu

Soldering & Surface Mount Technology (2016) 28 (3): 167–174.

https://doi.org/10.1108/SSMT-01-2016-0001

Published: 06 June 2016

View article titled, High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method

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