An Assessment of the Use of Lead in Electronics Assembly: Part 1

This report, presented as the keynote paper at Surface Mount International, is the culmination of joint efforts to assess the use of lead in electronics assembly. The study, which will be presented in two parts, involved the collaboration of the following participants: B. R. Allenby and J. P. Ciccarelli, AT&T, Basking Ridge, New Jersey; I. Artaki, J. R. Fisher and D. Schoenthaler, AT&T Bell Laboratories, ERC, Princeton, New Jersey; T. A. Carroll, Hughes, El Segundo, California; D. W. Dahringer, Y. Degani, R. S. Freund, T. E. Graedel, A. M. Lyons and J. T. Plewes, AT&T Bell Laboratories, Murray Hill, New Jersey; C. Gherman and H. Solomon, GE Aerospace, Philadelphia, Pennsylvania; C. Melton, Motorola Inc., Schaumburg, Illinois; G. C. Munie, AT&T Bell Laboratories, Indian Hill, Naperville, Illinois; and N. Socolowski, Alpha Metals, Jersey City, New Jersey.