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Volume 19, Issue 3
1 February 1993
Circuit World Cover Image for Volume 19, Issue 3
Review Article| February 01 1993

Equipment Selection for Tape Automated Bonding (TAB) Available to Purchase

M.C. Miller
M.C. Miller
Electronic Assembly Development Center, Hewlett Packard, Palo Alto, California, USA
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1993
Circuit World (1993) 19 (3): 49–52.
https://doi.org/10.1108/eb046213

The manufacturing process involving the bonding of ultra‐fine pitch TAB solder joints into printed circuit substrates requires precision equipment. This paper describes the basic components of any type of outer lead bonding (OLB) TAB equipment. It goes on to explain a selection methodology to be used when selecting equipment for customer applications. Specific examples are used to aid the equipment consumer in selecting the optimum equipment set and verifying the machine's accuracy and reliability.

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© MCB UP Limited
1993
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