Skip to Main Content
Article navigation
Volume 21, Issue 4
1 April 1995
Circuit World Cover Image for Volume 21, Issue 4
Review Article| April 01 1995

Low Cost Solder Bumped Flip Chip MCM‐L Demonstration Available to Purchase

M. Kelly;
M. Kelly
Hewlett‐Packard Company, Palo Alto, California, USA
Search for other works by this author on:
This Site
PubMed
Google Scholar
J. Lau
J. Lau
Hewlett‐Packard Company, Palo Alto, California, USA
Search for other works by this author on:
This Site
PubMed
Google Scholar
Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-602X
Print ISSN: 0305-6120
© MCB UP Limited
1995
Circuit World (1995) 21 (4): 14–17.
https://doi.org/10.1108/eb044044

A low cost multichip module employing solder bumped flip chips mounted on an organic substrate was demonstrated. This functional prototype was used to help assess the preliminary feasibility of low temperature solder bumped flip chip applications, from wafer design, sourcing and bumping, substrate design and fabrication, to MCM‐L assembly.

This content is only available via PDF.
© MCB UP Limited
1995
You do not currently have access to this content.
Don't already have an account? Register

Purchased this content as a guest? Enter your email address to restore access.

Please enter valid email address.
Email address must be 94 characters or fewer.
Pay-Per-View Access
$41.00
Rental
This article is also available for rental through DeepDyve. Read this now at DeepDyve
123 Views
8 Crossref
View Metrics
A fair cost function-based diffusion adaptive filtering control of a shunt hybrid active power filter for improved performance and power quality enhancement
Discrete mapping modeling and nonlinear characteristics analysis of fuel cell-battery hybrid energy storage parallel system
Multi-objective integrated VSG control strategy under unbalanced conditions
Design study of multistage low-pass type NGD circuit with RC-network for time-advance electronic function

Suggested Reading

Design and Procurement of Eutectic Sn/Pb Solder‐bumped Flip Chip Test Die and Organic Substrates
Circuit World (March,1995)
Flip‐chip Bonding on Green Tape Ceramic Substrates
Hybrid Circuits (March,1993)
Flip Chip Attach of Silicon and GaAs Fine Pitch Devices as well as Inner Lead TAB Attach Using Ball‐bump Technology
Hybrid Circuits (February,1994)
A new under bump metallurgy for solder bump flip chip applications
Microelectronics International (August,1998)
Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards
Circuit World (February,1993)

Related Chapters

Flipping the Managerial Accounting Principles Course: Effects on Student Performance, Evaluation, and Attendance
Advances in Accounting Education: Teaching and Curriculum Innovations
The Flipped Classroom Effect on Entrepreneurship Education: Applying Critical Pedagogy in Digital Environments
Delivering Entrepreneurship Education in Africa: New Perspectives
Transitioning from a Traditional Lecture Style Organic Chemistry Classroom into a “Flipped” Classroom
Broadening Participation in STEM: Effective Methods, Practices, and Programs

Recommended for you

These recommendations are informed by your reading behaviors and indicated interests.

Cited By

Google Scholar
CrossRef (8)
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal