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Journal Articles

A low‐cost chip size package – NuCSP

T. Chou, J. Lau

Circuit World (1998) 24 (1): 34–38.

https://doi.org/10.1108/030561201998000006

Published: 01 January 1998

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Journal Articles

Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting,and Vibration Conditions

J. Lau, K. Gratalo, E. Schneider, T. Marcotte, T. Baker

Circuit World (1996) 22 (1): 27–32.

https://doi.org/10.1108/03056129610799912

Published: 01 April 1996

View article titled, Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting,and Vibration Conditions

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Journal Articles

Low Cost Solder Bumped Flip Chip MCM‐L Demonstration

M. Kelly, J. Lau

Circuit World (1995) 21 (4): 14–17.

https://doi.org/10.1108/eb044044

Published: 01 April 1995

View article titled, Low Cost Solder Bumped Flip Chip MCM‐L Demonstration

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Journal Articles

Design and Procurement of Eutectic Sn/Pb Solder‐bumped Flip Chip Test Die and Organic Substrates

J. Lau, M. Heydinger, J. Glazer, D. Uno

Circuit World (1995) 21 (3): 20–24.

https://doi.org/10.1108/eb044033

Published: 01 March 1995

View article titled, Design and Procurement of Eutectic Sn/Pb Solder‐bumped Flip Chip Test Die and Organic Substrates

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Journal Articles

Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly

B. Wun, J. Lau

Circuit World (1995) 21 (3): 25–32.

https://doi.org/10.1108/eb044034

Published: 01 March 1995

View article titled, Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly

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Journal Articles

No Clean Mass Reflow of Large Plastic Ball Grid Array Packages

J. Lau, J. Miremadi, J. Gleason, R. Haven, S. Ottoboni, S. Mimura

Circuit World (1994) 20 (3): 15–22.

https://doi.org/10.1108/eb046258

Published: 01 February 1994

View article titled, No Clean Mass Reflow of Large Plastic Ball Grid Array Packages

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Journal Articles

Solder Joint Reliability of a Thin Small Outline Package (TSOP)

J. Lau, S. Golwalkar, P. Boysan, R. Surratt, R. Forhringer, S. Erasmus

Circuit World (1993) 20 (1): 12–19.

https://doi.org/10.1108/eb046232

Published: 01 April 1993

View article titled, Solder Joint Reliability of a Thin Small Outline Package (TSOP)

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Journal Articles

Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards

J. Lau, T. Krulevitch, W. Schar, M. Heydinger, S. Erasmus, J. Gleason

Circuit World (1993) 19 (3): 18–24.

https://doi.org/10.1108/eb046208

Published: 01 February 1993

View article titled, Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards

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Journal Articles

No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

J. Lau, R. Govila, C. Larner, Y.‐H. Pao, S. Erasmus, S. Dolot, M. Jalilian, M. Lancaster

Circuit World (1992) 19 (1): 19–26.

https://doi.org/10.1108/eb046187

Published: 01 April 1992

View article titled, No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

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Journal Articles

Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability

J. Lau, G. Dody, W. Chen, M. McShane, D. Rice, S. Erasmus, W. Adamjee

Circuit World (1992) 18 (2): 13–19.

https://doi.org/10.1108/eb046154

Published: 01 January 1992

View article titled, Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability

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Journal Articles

Effects of Rework on the Reliability of Pin Grid Array Interconnects

J. Lau, S. Leung, R. Subrahmanyan, D. Rice, S. Erasmus, C.Y. Li

Circuit World (1991) 17 (4): 5–10.

https://doi.org/10.1108/eb046140

Published: 01 March 1991

View article titled, Effects of Rework on the Reliability of Pin Grid Array Interconnects

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A low‐cost chip size package – NuCSP

Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting,and Vibration Conditions

Low Cost Solder Bumped Flip Chip MCM‐L Demonstration

Design and Procurement of Eutectic Sn/Pb Solder‐bumped Flip Chip Test Die and Organic Substrates

Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly

No Clean Mass Reflow of Large Plastic Ball Grid Array Packages

Solder Joint Reliability of a Thin Small Outline Package (TSOP)

Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards

No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability

Effects of Rework on the Reliability of Pin Grid Array Interconnects

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