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Journal Articles

Solder Joint Reliability of a Thin Small Outline Package (TSOP)

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J. Lau, S. Golwalkar, P. Boysan, R. Surratt, R. Forhringer, S. Erasmus
Journal: Circuit World
Circuit World (1993) 20 (1): 12–19.
https://doi.org/10.1108/eb046232
Published: 01 April 1993
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