Skip to Main Content
S. Erasmus
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Solder Joint Reliability of a Thin Small Outline Package (TSOP)

Available to Purchase
J. Lau, S. Golwalkar, P. Boysan, R. Surratt, R. Forhringer, S. Erasmus
Journal: Circuit World
Circuit World (1993) 20 (1): 12–19.
https://doi.org/10.1108/eb046232
Published: 01 April 1993
View article titled, Solder Joint Reliability of a Thin Small Outline Package (TSOP)
Open the PDF for Solder Joint Reliability of a Thin Small Outline Package (TSOP) in another window
Add to Citation Manager for Solder Joint Reliability of a Thin Small Outline Package (TSOP)
Journal Articles

Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards

Available to Purchase
J. Lau, T. Krulevitch, W. Schar, M. Heydinger, S. Erasmus, J. Gleason
Journal: Circuit World
Circuit World (1993) 19 (3): 18–24.
https://doi.org/10.1108/eb046208
Published: 01 February 1993
View article titled, Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards
Open the PDF for Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards in another window
Add to Citation Manager for Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards
Journal Articles

No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

Available to Purchase
J. Lau, R. Govila, C. Larner, Y.‐H. Pao, S. Erasmus, S. Dolot, M. Jalilian, M. Lancaster
Journal: Circuit World
Circuit World (1992) 19 (1): 19–26.
https://doi.org/10.1108/eb046187
Published: 01 April 1992
View article titled, No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)
Open the PDF for No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs) in another window
Add to Citation Manager for No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)
Journal Articles

Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability

Available to Purchase
J. Lau, G. Dody, W. Chen, M. McShane, D. Rice, S. Erasmus, W. Adamjee
Journal: Circuit World
Circuit World (1992) 18 (2): 13–19.
https://doi.org/10.1108/eb046154
Published: 01 January 1992
View article titled, Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability
Open the PDF for Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability in another window
Add to Citation Manager for Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability
Journal Articles

Effects of Rework on the Reliability of Pin Grid Array Interconnects

Available to Purchase
J. Lau, S. Leung, R. Subrahmanyan, D. Rice, S. Erasmus, C.Y. Li
Journal: Circuit World
Circuit World (1991) 17 (4): 5–10.
https://doi.org/10.1108/eb046140
Published: 01 March 1991
View article titled, Effects of Rework on the Reliability of Pin Grid Array Interconnects
Open the PDF for Effects of Rework on the Reliability of Pin Grid Array Interconnects in another window
Add to Citation Manager for Effects of Rework on the Reliability of Pin Grid Array Interconnects
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal