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Journal Articles

No Clean Mass Reflow of Large Plastic Ball Grid Array Packages

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J. Lau, J. Miremadi, J. Gleason, R. Haven, S. Ottoboni, S. Mimura
Journal: Circuit World
Circuit World (1994) 20 (3): 15–22.
https://doi.org/10.1108/eb046258
Published: 01 February 1994
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Journal Articles

Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards

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J. Lau, T. Krulevitch, W. Schar, M. Heydinger, S. Erasmus, J. Gleason
Journal: Circuit World
Circuit World (1993) 19 (3): 18–24.
https://doi.org/10.1108/eb046208
Published: 01 February 1993
View article titled, Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards
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